Schmoll's laser machines are renowned for their exceptional precision in drilling and cutting, but their capabilities extend further and include also highly accurate skiving functions. This specialized process allows for the selective removal of material, offering a crucial advantage in the production of advanced PCBs and enabling intricate designs that demand unparalleled control.
With precise adjustments of the laser process and careful control over process adjustments and the number of passes, our machines can ablate material deep within a stack, achieving remarkable accuracy. This means we can remove microns of material almost without penetrating or damaging the underlying adjacent layers. This level of control is vital for complex applications where material integrity and minimal thermal impact are paramount.
A prime example of this advanced capability is our customers successfully ablating immersion coatings with Schmoll laser machines. Another common application involves skiving until the copper pad on an inner layer is precisely reached.
Contact us today to explore how Schmoll's multi-layer laser drilling solutions can benefit your production!
