Application | Photohead | Resolution | Machine Platform |
---|---|---|---|
QTA, MLB, HDI, CM | LLS30 | 30 µm L/S | MDI-ST (XL) MDI-TTG MDI-Flex (XL) |
Advanced HDI, mSAP, FPC, CM | LLS15 | 15 µm L/S | MDI-ST (XL) MDI-TTG MDI-FLEX (XL) MDI-ST ULTRA |
mSAP, FPC, ICS, CM | LLS10 | 10 µm L/S | MDI-ST ULTRA MDI-TTG ULTRA |
mSAP, PKG, ICS, PLP | LLS07 | 7 µm L/S | MDI-ST ULTRA MDI-TTG ULTRA |
PKG, ICS, PLP, WLP, FOWLP | LLS04 | 4 µm L/S | MDI-ST ULTRA |
PKG, ICS, PFP, WLP, FOWLP | LLS2500 | 2.5 µm L/S | MDI-ST ULTRA |
QTA = Quick Turn Around | MLB = Multilayer Boards | HDI = High Density Interconnect | CM = Chemical Milling | mSAP = Modified semi-additive processes | FPC = Flexible PCB
ICS = IC Substrates | PKG = Packaging | PLP = Panel level packaging | WLP = Wafer level packaging | FOWLP = Fan out wafer level packaging
MDI-ULTRA - Highest accuracy and precision platform for substrate, packaging and related applications. The ultra-precision machine design applies specific materials for critical components at selected positions in the machine to enable reaching greater accuracy and precision as well as maintaining the overall system with high stability. Adding the high resolution imaging system, combined with its real-time autofocus function makes this the suitable platform for advanced electronics or high-tech packaging applications.
Whether as R&D-tool or production equipment, manual or fully automated handling, the Schmoll MDI Team is happy to learn about your requirements and present a suitable solution.