Solutions for laser processing of flex and rigid PCBs
MicroCutting Structuring
Microcutting
Structuring of Complex Contours
In many areas of printed circuit board manufacturing, laser cutting and structuring are key requirements. Separation of flex connectors, depaneling, and the creation of cavities are just some of the many benefits of this technology. In this context, picosecond and nanosecond lasers are the tools of choice. This technology is highly productive and flexible, even when manufacturing small batch sizes. Largely due to the carbon-free material removal and a kerf of only 20 microns, it is possible to cut, for example, flex connectors with high dimensional accuracy and excellent quality.
High-precision cuttingand structuring
No. of stations
Max. panel size
Max. cutting speed
Accuracy
Platform
PicoµFlex
Space saving base
PicoFlex/PicoµCut
High performance cutting
PicoMaster
High volume platform
ContactForm
Schmoll Maschinen GmbH