Highly efficient direct imaging for resist and soldermask applications
Soldermask Imaging
SoldermaskSolutions
High power light engines with different resolutions
| Application | Photohead | Resolution | Machine Platform |
|---|---|---|---|
| QTA, MLB, HDI | Solderbeam | 30 µm L/S | MDI-TTG Solderbeam |
| QTA, MLB, HDI, CM | LLS30 | 30 µm L/S | MDI-ST (XL) MDI-TTG MDI-Flex (XL) |
| Advanced HDI, mSAP, FPC, CM | LLS15 | 15 µm L/S | MDI-ST (XL) MDI-TTG MDI-FLEX (XL) MDI-ST ULTRA |
| mSAP, FPC, ICS, CM | LLS10 | 10 µm L/S | MDI-ST ULTRA MDI-TTG ULTRA |
| mSAP, PKG, ICS, PLP | LLS07 | 7 µm L/S | MDI-ST ULTRA MDI-TTG ULTRA |
QTA = Quick Turn Around | MLB = Multilayer Boards | HDI = High Density Interconnect | CM = Chemical Milling | mSAP = Modified semi-additive processes | FPC = Flexible PCB
ICS = IC Substrates | PKG = Packaging | PLP = Panel level packaging | WLP = Wafer level packaging | FOWLP = Fan out wafer level packaging
Versatile and powerful
Imaging of Soldermask
Schmoll‘s Direct Imaging systems provide high flexibility of imaging various different materials. The use of multiple wavelengths allow for straight sidewalls and minimized undercut when imaging photoresist or soldermask ink. Challenges in precise recognition of targets, especially on different colored inks, are addressed by the use of Schmoll‘s CCD and ringlight technology.
A mechanical clamping system can in addition to the vacuum table support the proper fixation of warped panels.
The MDI-TTG SOLDERBEAM is a dedicated platform to image soldermask at high speed and efficiency. The Tandem table concept enables operators to properly handle panels at no timeloss while registration and imaging processes can happen in parallel. The exposure speed even on inks demanding for high exposure energy becomes very attractive.
Soldermask ImagingMachine platforms
Max. panel size
Automation
No. of heads
Overall dimensions
*depends on machine configuration
MDI-ST
Single table machine
MDI-TTG
Tandem table machine
MDI-TTG SOLDERBEAM
Dedicated soldermask machine
HighlightsOptions
A selection of product highlights and configuration options.
Automatic clamping system
Mechanical clamping system, adjustable to fit different panel sizes. Optional panel fixation to standard vacuum table. On MDI-TTG = automatic format adjustment. Capability to clamp thin foils or thick panels. Transparent clamps to still allow exposure of clamped panel edge.
Full inline system for MDI-TTG
Highly productive Inline-System of MDI-TTG machine platform combined with Schmoll‘s own automation handling system. The handling system can be added to a tandem table machine to reach highest productivity and fully automate the system, that can either be operated as automated island (with Loader+unloader) or be fully integrated into an automated production line.
Handling system for MDI-ST
Combination of single table machine with handling system to remain small and compact footprint. Automation possible with LHMT Robiflex or other external loader systems.
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Schmoll Maschinen GmbH