Application | Photohead | Resolution | Machine Platform |
---|---|---|---|
QTA, MLB, HDI, CM | LLS30 | 30 µm L/S | MDI-ST (XL) MDI-TTG MDI-Flex (XL) |
Advanced HDI, mSAP, FPC, CM | LLS15 | 15 µm L/S | MDI-ST (XL) MDI-TTG MDI-FLEX (XL) MDI-ST ULTRA |
mSAP, FPC, ICS, CM | LLS10 | 10 µm L/S | MDI-ST ULTRA MDI-TTG ULTRA |
mSAP, PKG, ICS, PLP | LLS07 | 7 µm L/S | MDI-ST ULTRA MDI-TTG ULTRA |
PKG, ICS, PLP, WLP, FOWLP | LLS04 | 4 µm L/S | MDI-ST ULTRA |
PKG, ICS, PFP, WLP, FOWLP | LLS2500 | 2.5 µm L/S | MDI-ST ULTRA |
QTA = Quick Turn Around | MLB = Multilayer Boards | HDI = High Density Interconnect | CM = Chemical Milling | mSAP = Modified semi-additive processes | FPC = Flexible PCB
ICS = IC Substrates | PKG = Packaging | PLP = Panel level packaging | WLP = Wafer level packaging | FOWLP = Fan out wafer level packaging
Schmoll‘s Direct Imaging systems provide high flexibility of imaging various different materials. The use of multiple wavelengths allow for straight sidewalls and
minimized undercut when imaging photoresist or soldermask ink. Specific machine features allow for proper handling and panel fixation, CCD alignment on different target types and shapes and self-monitoring auto-check functions for longterm stability.
The compact machine design of either a single table or tandem table platform addresses the common challenge of limited space within cleanrooms. The modular system setup with multiple photoheads allows to define a suitable configuration to match our customer‘s needs and capacity goals.