The XRA³ series X-ray drilling machine and the Optiflex II post-etch punch machine are the optimal solution for referencing printed circuit boards.
In combination with the available options, these machine series fulfill any requirement in the field of multi-layer registration.
The XRA³ series X-ray machine offers a first-class solution for the precise referencing of PCBs.
Thanks to the available options, this machine series fulfills all requirements in the field of PCB registration. A higly advanced vision system, consisting of a 70 kV microfocus X-ray source and a high-resolution CMOS detector, detects the PCBs and enables their precise referencing and processing by the integrated drilling units.
The patented flex-table mounting plate, which ensures PCB improved registration thanks to the full-surface vacuum system is free of dead zones and offers unique process options for X-ray measurements and drilling.
The proven, stable mechanical engineering of Schmoll Maschinen, combined with linear motor technology in all axes, also ensures high system availability and minimal maintenance costs for this series.
The XRA series is available both as a manual and a fully automatic system.
A selection of product highlights and configuration options.
Featuring an X-ray source with 70 kV (90 kV as option) and a double head shutter system configuration. Equipped with CCD cameras and a powerful vacuum clamping system for perfect panel flatness and max. registration accuracy, further enhanced by an entry shift function. The new system is capable of OCR & DMC identification and can handle panel marking and serialization tasks.
The X-ray source can remain switched on during loading and unloading, leading to faster cycle times by avoiding startup delays, while flexible shutter use during machining protects embedded components, ensuring maximum stability and extended lifetime of the X-ray source for even more accurate results.
The high-precision Optiflex II inner layer punch is ideal for die-cutting inner layers up to a thickness of 50 µm.
The intelligent transport system minimizes the impact on the panel to be transported thanks to synchronized conveyor belts and separate vacuum shuttles. Alignment is carried out using a high-precision XYPhi unit and two CCD cameras.
In the punch process area, up to eight CCD cameras, in conjunction with permanently installed tools, ensure outstanding hole quality. A double cutting clearance of the punching tools is available for punching different thicknesses (0.05 to 1.5 mm), which further optimizes hole quality.
The Optiflex II is complemented by a user-friendly control system, which can be expanded to include an SPC database if required.
A selection of product highlights and configuration options.
Improved registration accuracy due to work piece color specific selection of RGB light.
Fixed tooling kit for highest accuracy and repeatability.