schmoll maschinen

Microhole Drilling

Microhole drilling of high-end packaging products
Pico-secondlaser ablation
For reisdue free material removal

The laser micro-machine Picoµdrill is highly productive and accurate for microhole drilling in various materials. Featuring up to four Galvo scanners across two workstations, it is ideal for mass production. Optional fully automatic handling enhances efficiency. The high-energy picosecond laser enables cold and precise material removal, minimizing thermal damage and preserving material integrity. Its versatile design handles a range of materials and integrates easily into production lines, offering customizable settings for different needs, making it a valuable tool for high-precision manufacturing.

Pico-second laserIC Substrate / Semicon Market

No. of stations
Max. panel size
Via size
Productivity
Accuracy
Platform
NanoDrill
1
700 mm x 700 mm
20-45 µm
>1800 vias/sec.
±9 µm
Split axis base
TECHNICAL DATA
PicoµDrill
2 (1)
610 mm x 610 mm
10-30 µm
>3600 vias/sec.
±9 µm
Split axis base
TECHNICAL DATA
PicoMaster
2
610 mm x 711 mm
Optional selection
>8000 vias/sec.
±9 µm
Crosstable
TECHNICAL DATA
NanoDrill
High accuracy beam stabilization
PicoµDrill
Super compact split axis base
PicoMaster
Highest accuracy with CT base platform
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