Micro-via drilling of FR4 and filled substrates
Hybrid Via Drilling
Laser drillingof micro-vias
Efficiently and cost-effective
The dual laser combination of UV/CO2 effectively excavates material and drills cleanly through both copper and dielectric (non-reinforced or glass-reinforced) materials. The UV laser precisely ablates dielectric material, while the CO2 laser efficiently cuts copper layers. This synergy ensures superior drilling accuracy and minimal thermal damage. The method's adaptability allows for adjustments in laser parameters, accommodating various material compositions and thicknesses, making it valuable across multiple industries requiring precise material processing.
EconomicalMicrovias drilling
No. of stations
Max. panel size
Via size
Productivity
Accuracy
Platform
Combi350
Super compact machine base
Combi500
Performance version
CombiMaster
2-table, 4-beam hybrid machine
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Schmoll Maschinen GmbH