Traditionally, laser drilling and ablation primarily focused on creating vias from the top layer to the immediate next layer. However, the evolving demands of advanced PCB designs are leading to increasing customer requests for drilling all the way to the third layer, or even deeper. Schmoll laser machines are engineered to meet these challenges.
While achieving precise multi-layer laser drilling requires a slightly different process approach, our advanced laser systems are fully capable. Customers considering this capability should carefully evaluate several critical factors:
- Aspect Ratio and Material Thicknesses: The relationship between hole depth and diameter, combined with the varying thicknesses of materials in the stack-up, is crucial for success.
- Hole Diameter and Taper: Achieving the desired hole diameter and managing the taper (the angle of the hole walls) through multiple layers are key to signal integrity.
- Following Processes: Consideration must be given to how subsequent manufacturing steps will interact with these deeper laser-drilled features.
When these design and process parameters are aligned, Schmoll's laser drilling technology provides the precision and control necessary to achieve exceptional results, enabling complex and high-performance PCB structures.
Contact us today to explore how Schmoll's multi-layer laser drilling solutions can benefit your production!
