PicoMaster 1.0 for vias < 10 µm

This advanced platform has been specifically designed to meet the challenges of modern micromachining, enabling MicroVias with diameters of less than 10 micrometers to be drilled efficiently and reliably. By using the latest laser technology and innovative beam stabilization techniques, we set new standards in machining accuracy and meet the demanding requirements of the microelectronics, medical technology and semiconductor industries. In this way, we ensure that manufacturing processes not only meet current industry standards, but exceed them - while at the same time reducing operating costs and improving efficiency. With the PicoMaster, you can raise your production to a new level and secure a decisive competitive advantage in the high-tech industry.