As the PCB industry embraces miniaturization, the demand for advanced direct imaging solutions has never been greater. Technologies like MSAP (Modified Semi-Additive Process) and ASAP are driving the growth of SLP (Substrate-Like PCBs) and IC substrates. Additionally, direct imaging is becoming critical in packaging applications, such as panel-level packaging, wafer-level packaging, and fan-out wafer-level packaging.
Schmoll Maschinen has been at the forefront of this evolution with our MDI-Ultra machines, designed specifically for ultra-fine-line exposure. These advanced systems support exposure of 10/10, 7/7, 4/4, and even 2/2 micron line spaces, catering to the most demanding PCB and also packaging applications.
Beyond their innovative light sources, MDI-Ultra machines are equipped with unique configuration solutions tailored specifically for ultra-fine-line applications. These solutions set them apart from standard direct imaging machines, enabling superior precision and adaptability for modern PCB and packaging technologies.
Contact us to learn how Schmoll’s MDI-Ultra can support your journey into ultra-fine-line PCB and advanced packaging production.
